Within the next two years, computer chips will be so small and so fast—and consequently so hot—that current methods of cooling will be inadequate.

Cooligy’s breakthrough active microstructure cooling method is the solution resulting in extremely low thermal resistance.

The Cooligy method, originally developed at Stanford University’s mechanical engineering department, uses common materials to produce a closed-loop cooling system for CPUs, ASICS, graphics chips, and the large programmable gate arrays.

The small size, light weight, and excellent thermal performance of the Cooligy system allow tighter packing of components on the circuit board and higher reliability of individual chips as well as the entire system. By contrast, large finned heat sinks or heat pipes based cooling systems are heavy, inefficient and inadequate to the working nerds of next generation of high performance chips.

Cooligy is currently designing and manufacturing products and subsystems for sale to large electronics manufacturers.